Flexible circuits
The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
19.07.2011
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention provides a circuit creation technology that improves conductive line manufacture by adding active and elemental palladium onto the surface of a substrate. The palladium is disposed in minute amounts on the surface and does not form a conductive layer by itself, but facilitates subsequent deposition of a metal onto the surface, according to the pattern of the palladium, to form the conductive lines. |
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Bibliography: | Application Number: US20070854274 |