Reduction of attraction forces between silicon wafers

A method for reducing attraction forces between wafers (4) is provided. This method includes the step of, after sawing and before dissolution of the adhesive (5), introducing spacers (6) between wafers (4). A wafer singulation method and an agent for use in the method are also provided.

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Bibliographic Details
Main Authors WANG PER ARNE, SAUAR ERIK
Format Patent
LanguageEnglish
Published 28.06.2011
Subjects
BASIC ELECTRIC ELEMENTS
CLEANING
CLEANING IN GENERAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:A method for reducing attraction forces between wafers (4) is provided. This method includes the step of, after sawing and before dissolution of the adhesive (5), introducing spacers (6) between wafers (4). A wafer singulation method and an agent for use in the method are also provided.
Bibliography:Application Number: US20060988132