Reduction of attraction forces between silicon wafers
A method for reducing attraction forces between wafers (4) is provided. This method includes the step of, after sawing and before dissolution of the adhesive (5), introducing spacers (6) between wafers (4). A wafer singulation method and an agent for use in the method are also provided.
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
28.06.2011
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Subjects | |
Online Access | Get full text |
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Summary: | A method for reducing attraction forces between wafers (4) is provided. This method includes the step of, after sawing and before dissolution of the adhesive (5), introducing spacers (6) between wafers (4). A wafer singulation method and an agent for use in the method are also provided. |
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Bibliography: | Application Number: US20060988132 |