Method for manufacturing film or piezoelectric film
A simple method is provided for manufacturing a film such as a piezoelectric film wherein the adhesiveness of the film on a substrate can be improved. An aerosol containing particles is ejected onto a substrate so that the particles adhere thereto, wherein the ratio between the Vickers hardness Hv(b...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
07.06.2011
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Subjects | |
Online Access | Get full text |
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Summary: | A simple method is provided for manufacturing a film such as a piezoelectric film wherein the adhesiveness of the film on a substrate can be improved. An aerosol containing particles is ejected onto a substrate so that the particles adhere thereto, wherein the ratio between the Vickers hardness Hv(b) of the adhesion surface to which the particles are attached in the substrate, and the Vickers hardness Hv(p) of the particles is within a range of 0.39 Hv(p)/Hv(b) 3.08. The adhesiveness between the particles and the substrate can thereby be improved to reliably form a film. The present invention can be satisfactorily applied to the formation of a piezoelectric film. |
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Bibliography: | Application Number: US20050090173 |