Flexible printed circuit board and electronic component assembly
A flexible printed circuit (FPC) and electronic component assembly. The FPC comprises a first protective layer having a first opening, a main layer on the first protective layer, and a second protective layer having a second opening exposing the main layer. The heat produced from the electronic comp...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
17.05.2011
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Subjects | |
Online Access | Get full text |
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Summary: | A flexible printed circuit (FPC) and electronic component assembly. The FPC comprises a first protective layer having a first opening, a main layer on the first protective layer, and a second protective layer having a second opening exposing the main layer. The heat produced from the electronic component can be transmitted to the main layer by a heat-conductive medium between the electronic component and the main layer, and can be diffused via the first opening. |
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Bibliography: | Application Number: US20060425442 |