Dielectric layer for semiconductor device and method of manufacturing the same

A semiconductor device comprises a silicate interface layer and a high-k dielectric layer overlying the silicate interface layer. The high-k dielectric layer comprises metal alloy oxides.

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Bibliographic Details
Main Authors LEE JONG-HO, LEE NAE-IN
Format Patent
LanguageEnglish
Published 08.03.2011
Subjects
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Summary:A semiconductor device comprises a silicate interface layer and a high-k dielectric layer overlying the silicate interface layer. The high-k dielectric layer comprises metal alloy oxides.
Bibliography:Application Number: US20080098373