Laser micromachining and methods of same

The described embodiments relate to laser micromachining a substrate. One exemplary method includes forming a feature into a substrate, at least in part, by directing a laser beam at the substrate. During at least a portion of said forming, the method includes supplying liquid to at least a first re...

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Bibliographic Details
Main Authors KHAVARI MEHRGAN, HUTH MARK C, OTIS CHARLES, POLLARD JEFFREY R
Format Patent
LanguageEnglish
Published 22.02.2011
Subjects
CLADDING OR PLATING BY SOLDERING OR WELDING
CORRECTION OF TYPOGRAPHICAL ERRORS
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME
LINING MACHINES
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PRINTING
SELECTIVE PRINTING MECHANISMS
SOLDERING OR UNSOLDERING
STAMPS
TRANSPORTING
TYPEWRITERS
WELDING
WORKING BY LASER BEAM
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Summary:The described embodiments relate to laser micromachining a substrate. One exemplary method includes forming a feature into a substrate, at least in part, by directing a laser beam at the substrate. During at least a portion of said forming, the method includes supplying liquid to at least a first region of the feature along a first liquid supply path and supplying liquid to at least a second different region of the feature along at least a second liquid supply path.
Bibliography:Application Number: US20030713298