Method of fabricating non-volatile memory device
A method of fabricating a non-volatile memory device, A tunnel insulating layer, a floating gate, and a pad nitride layer is formed on a semiconductor substrate. A isolation region of the semiconductor substrate is formed by etching to a predetermined depth, and a liner insulating layer is formed on...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
15.02.2011
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Subjects | |
Online Access | Get full text |
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Summary: | A method of fabricating a non-volatile memory device, A tunnel insulating layer, a floating gate, and a pad nitride layer is formed on a semiconductor substrate. A isolation region of the semiconductor substrate is formed by etching to a predetermined depth, and a liner insulating layer is formed on an entire surface of the resulting trench for device isolation. A filling insulation layer is formed on the liner insulating layer to fill the trench and a first etching process is performed on the filling insulation layer and the liner insulating layer. The surface of semiconductor is recessed by performing a second etching process on the filling insulation layer. A capping layer is formed on an entire surface of the result formed by the second etching process. The device isolation layer of a concave shape is formed by performing an etching process on the capping layer. |
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Bibliography: | Application Number: US20080164879 |