Thermal ejection of solution having solute onto device medium

A solution is provided that includes a non-aqueous organic solvent within which a solute has been dissolved. A thermal-fluid ejection mechanism is provided that has fluid-ejection nozzles and that is capable of thermally ejecting the solution. A device medium is provided that has a three-dimensional...

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Main Authors OTIS DAVID, NIELSEN JEFFREY A, GISEL WAYNE E, MEEHAN GERALD F, SAMUEL NK PETER, LEIGH DAVID, FARR ISAAC
Format Patent
LanguageEnglish
Published 11.01.2011
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Summary:A solution is provided that includes a non-aqueous organic solvent within which a solute has been dissolved. A thermal-fluid ejection mechanism is provided that has fluid-ejection nozzles and that is capable of thermally ejecting the solution. A device medium is provided that has a three-dimensional surface on which the solution is to be ejected. The fluid-ejection nozzles of the thermal fluid-ejection mechanism are controlled to eject the solution onto the three-dimensional surface of the device medium in accordance with a desired pattern.
Bibliography:Application Number: US20060553834