Thermal ejection of solution having solute onto device medium
A solution is provided that includes a non-aqueous organic solvent within which a solute has been dissolved. A thermal-fluid ejection mechanism is provided that has fluid-ejection nozzles and that is capable of thermally ejecting the solution. A device medium is provided that has a three-dimensional...
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Main Authors | , , , , , , |
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Format | Patent |
Language | English |
Published |
11.01.2011
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Subjects | |
Online Access | Get full text |
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Summary: | A solution is provided that includes a non-aqueous organic solvent within which a solute has been dissolved. A thermal-fluid ejection mechanism is provided that has fluid-ejection nozzles and that is capable of thermally ejecting the solution. A device medium is provided that has a three-dimensional surface on which the solution is to be ejected. The fluid-ejection nozzles of the thermal fluid-ejection mechanism are controlled to eject the solution onto the three-dimensional surface of the device medium in accordance with a desired pattern. |
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Bibliography: | Application Number: US20060553834 |