Spray dispensing method for applying liquid metal

Embodiments of a method for applying a thermal-interface material are described. During this method, a first surface of a heat-removal device and a second surface of a semiconductor die are prepared. Next, a region on a given surface, which is at least one of the first surface and the second surface...

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Bibliographic Details
Main Authors TICE GREGORY L, CROWDER JAMES M, MCDONALD ANWYL M, BLANCO, JR. RICHARD LIDIO, WOO OSCAR, URQUHART JONATHAN N, BAILEY SEAN A, HILLMAN MICHAEL D, SALEHI AMIR, VAN NORDEN JEFFREY J, SMITH RONALD J, ANDERSON CLAYTON R
Format Patent
LanguageEnglish
Published 23.11.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Embodiments of a method for applying a thermal-interface material are described. During this method, a first surface of a heat-removal device and a second surface of a semiconductor die are prepared. Next, a region on a given surface, which is at least one of the first surface and the second surface, is defined. Then, the thermal-interface material is applied to at least the region, where the thermal-interface material includes a material that is a liquid metal over a range of operating temperatures of the semiconductor die.
Bibliography:Application Number: US20070954158