Electronic component packaging

The invention relates to a method to seal a cavity, comprising a hole (6), comprising: the deposition on at least part of the cover, or an electrically conductive material (4, 5), the conveyance of part of this material by electro-migration into the hole (6) to form a plug (20).

Saved in:
Bibliographic Details
Main Author DIEM BERNARD
Format Patent
LanguageEnglish
Published 07.09.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
SEMICONDUCTOR DEVICES
TRANSPORTING
Online AccessGet full text

Cover

More Information
Summary:The invention relates to a method to seal a cavity, comprising a hole (6), comprising: the deposition on at least part of the cover, or an electrically conductive material (4, 5), the conveyance of part of this material by electro-migration into the hole (6) to form a plug (20).
Bibliography:Application Number: US20060459187