Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same
Disclosed herein are a semiconductor package substrate and a method for fabricating the same. In the semiconductor package substrate, the circuit layer of the wire bonding pad side differs in thickness from that of the ball pad side to which a half etching process is applied. In addition, a connecti...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
03.08.2010
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Subjects | |
Online Access | Get full text |
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