Method of manufacturing an ultrasonic probe
For providing a flexible printed circuit board in which the distance between each of plural wiring patterns is a desired distance by cutting the flexible printed circuit board having plural wiring patterns, plural wiring patterns are formed so as to extend on the surface of an electrically insulativ...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
20.07.2010
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Subjects | |
Online Access | Get full text |
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Summary: | For providing a flexible printed circuit board in which the distance between each of plural wiring patterns is a desired distance by cutting the flexible printed circuit board having plural wiring patterns, plural wiring patterns are formed so as to extend on the surface of an electrically insulative base film, and each of the plural wiring patterns is formed so as to include a portion where the distance between each of them is narrowed along the extending direction of the base film. |
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Bibliography: | Application Number: US20070767664 |