Multichip package system
A multichip integrated circuit package system is provided attaching a first integrated circuit die on a substrate top surface, mounting a second integrated circuit die over the first integrated circuit die, connecting an external interconnect on a substrate bottom surface, and forming a first encaps...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
04.05.2010
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Subjects | |
Online Access | Get full text |
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Summary: | A multichip integrated circuit package system is provided attaching a first integrated circuit die on a substrate top surface, mounting a second integrated circuit die over the first integrated circuit die, connecting an external interconnect on a substrate bottom surface, and forming a first encapsulation having a recess to expose a portion of the substrate bottom surface and the external interconnect. |
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Bibliography: | Application Number: US20060278418 |