Package for semiconductor devices

To prevent or alleviate the occurrence of stress in the junction portion between the semiconductor element and the semiconductor package for mounting the semiconductor element, so that cracks will not occur even when there is mounted a semiconductor element having a low strength. A package for semic...

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Bibliographic Details
Main Authors OOI KAZUHIKO, MATSUMOTO SHUNICHIRO, KODAIRA TADASHI, WATARI EISAKU, NAKAMURA JYUNICHI
Format Patent
LanguageEnglish
Published 13.04.2010
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:To prevent or alleviate the occurrence of stress in the junction portion between the semiconductor element and the semiconductor package for mounting the semiconductor element, so that cracks will not occur even when there is mounted a semiconductor element having a low strength. A package for semiconductor devices is formed as a laminate of many layers including a plurality of conducting layers and insulating resin layers that are alternately laminated one upon the other and having, on one surface of the laminate, a portion for mounting a semiconductor element. The whole region or some region(s) of the insulating resin layers of the laminate, including at least the portion for mounting the semiconductor element and the peripheries thereof, are constituted by a prepreg obtained by impregnating a woven fabric of a liquid crystal polymer with an insulating resin.
Bibliography:Application Number: US20070892927