Mountable integrated circuit package-in-package system with adhesive spacing structures
A mountable integrated circuit package-in-package system is provided including mounting an adhesion spacer over an integrated circuit die and a package substrate, mounting an integrated circuit package system having an inner adhesion structure with the inner adhesion structure on the adhesion spacer...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | English |
Published |
30.03.2010
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | A mountable integrated circuit package-in-package system is provided including mounting an adhesion spacer over an integrated circuit die and a package substrate, mounting an integrated circuit package system having an inner adhesion structure with the inner adhesion structure on the adhesion spacer, and forming a package encapsulation for covering the integrated circuit package system over the adhesion spacer. |
---|---|
Bibliography: | Application Number: US20060617413 |