Process for removing material from a substrate

A process for skiving a substrate is described, wherein the substrate is skived with a roller or a device or apparatus including the roller. The roller provides a cleaner skive than previously known methods without damage to underlying materials.

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Bibliographic Details
Main Authors WEINER MEGAN L, RANKIN, JR. CHARLES M, RICKS THEODORE K, MACAULEY JOHN P, COLEMAN RUSTY J
Format Patent
LanguageEnglish
Published 30.03.2010
Subjects
CINEMATOGRAPHY
COMBINED OPERATIONS
CUTTING
DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING
ELECTROGRAPHY
ELECTROPHOTOGRAPHY
GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS
HAND CUTTING TOOLS
HOLOGRAPHY
MACHINE TOOLS
MAGNETOGRAPHY
METAL-WORKING NOT OTHERWISE PROVIDED FOR
OTHER WORKING OF METAL
PERFORMING OPERATIONS
PHOTOGRAPHY
PHYSICS
SEVERING
TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
TECHNICAL SUBJECTS COVERED BY FORMER USPC
TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
TRANSPORTING
UNIVERSAL MACHINE TOOLS
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Summary:A process for skiving a substrate is described, wherein the substrate is skived with a roller or a device or apparatus including the roller. The roller provides a cleaner skive than previously known methods without damage to underlying materials.
Bibliography:Application Number: US20040851913