Pressure sense die pad layout and method for direct wire bonding to programmable compensation integrated circuit die

• Main Authors: BRADLEY ALISTAIR D, BENTLEY IAN
• Format: Patent
• Language: English
• Published: 16.03.2010
• Subjects: MEASURING; MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE; PHYSICS; TESTING

A method for direct die-to-die wire bonding incorporates a pressure sense die and a programmable compensation IC die that can be mounted on a ceramic substrate. The two die can be positioned beside each other such that wire bond pads on the pressure sense die and bonding leads on the compensation IC...