Pressure sense die pad layout and method for direct wire bonding to programmable compensation integrated circuit die

A method for direct die-to-die wire bonding incorporates a pressure sense die and a programmable compensation IC die that can be mounted on a ceramic substrate. The two die can be positioned beside each other such that wire bond pads on the pressure sense die and bonding leads on the compensation IC...

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Bibliographic Details
Main Authors BRADLEY ALISTAIR D, BENTLEY IAN
Format Patent
LanguageEnglish
Published 16.03.2010
Subjects
MEASURING
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE
PHYSICS
TESTING
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Summary:A method for direct die-to-die wire bonding incorporates a pressure sense die and a programmable compensation IC die that can be mounted on a ceramic substrate. The two die can be positioned beside each other such that wire bond pads on the pressure sense die and bonding leads on the compensation IC die are in same order. The pressure sense die and the compensation IC can be connected directly with wire bonds in order to reduce the number of wire bonds and to improve reliability. The pressure sense die can be designed with multiple wire bond pad patterns in order to be utilized with different programmable compensation IC dies.
Bibliography:Application Number: US20080038156