Smart interconnect for modular multi-component embedded devices

A smart interconnect for modular multi-component embedded devices is described. In an embodiment of a smart interconnect for modular multi-component embedded devices, a desired functionality of a stack of hardware boards is accessed. For example, a user may select a new functionality for the stack o...

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Bibliographic Details
Main Authors PRIYANTHA NISSANKA B, ZHAO FENG, LYMPEROPOULOS DIMITRIOS
Format Patent
LanguageEnglish
Published 22.12.2009
Subjects
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
CURRENT COLLECTORS
ELECTRIC DIGITAL DATA PROCESSING
ELECTRICITY
LINE CONNECTORS
PHYSICS
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Summary:A smart interconnect for modular multi-component embedded devices is described. In an embodiment of a smart interconnect for modular multi-component embedded devices, a desired functionality of a stack of hardware boards is accessed. For example, a user may select a new functionality for the stack of hardware boards. The desired functionality is then transmitted to a board in the stack of hardware boards and the board is configured to implement the desired functionality of the stack of hardware boards.
Bibliography:Application Number: US20070676097