Smart interconnect for modular multi-component embedded devices
A smart interconnect for modular multi-component embedded devices is described. In an embodiment of a smart interconnect for modular multi-component embedded devices, a desired functionality of a stack of hardware boards is accessed. For example, a user may select a new functionality for the stack o...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
22.12.2009
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Subjects | |
Online Access | Get full text |
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Summary: | A smart interconnect for modular multi-component embedded devices is described. In an embodiment of a smart interconnect for modular multi-component embedded devices, a desired functionality of a stack of hardware boards is accessed. For example, a user may select a new functionality for the stack of hardware boards. The desired functionality is then transmitted to a board in the stack of hardware boards and the board is configured to implement the desired functionality of the stack of hardware boards. |
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Bibliography: | Application Number: US20070676097 |