Apparatus for applying conductive paste onto electronic component

• Main Author: KIM JAE TAEK
• Format: Patent
• Language: English
• Published: 06.10.2009
• Subjects: APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE; CLADDING OR PLATING BY SOLDERING OR WELDING; COMBINED OPERATIONS; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRICITY; MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; OTHER WORKING OF METAL; PERFORMING OPERATIONS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; RESISTORS; SOLDERING OR UNSOLDERING; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING; UNIVERSAL MACHINE TOOLS; WELDING; WORKING BY LASER BEAM

An apparatus and a method for applying a conductive paste, for forming electrodes, onto an electronic component, such as a micro chip device. The apparatus includes a first jig unit provided with paste holes, which are filled with the conductive paste; and a second jig unit being movable and provided with extruding pins, which are inserted into the paste holes of the first jig unit, for allowing the conductive paste to be applied onto the electronic component. The conductive paste is applied onto the electronic component, while the electronic component is loaded onto or unloaded from the first jig unit. The apparatus and the method allow the conductive paste for forming electrodes to be precisely applied onto the electronic component, easily adjust the amount of the applied conductive paste, prevent the spreading of the conductive paste or the incorrect application of the conductive paste, allow jig units, for applying the conductive paste onto the electronic component, to be used for a long time without replacement or washing, cause the reduction of the maintenance costs of the apparatus, and facilitate the formation of electrodes having various shapes on the electronic component.