Method of disposing and arranging dummy patterns

A method of disposing dummy patterns is described, which is used for increasing the pattern density of an aluminum pad layer. A substrate is provided, and an aluminum pad material layer is formed on the substrate. Then, the aluminum pad material layer is patterned to form the aluminum pad layer whic...

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Bibliographic Details
Main Author HOU HSIN-MING
Format Patent
LanguageEnglish
Published 28.07.2009
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method of disposing dummy patterns is described, which is used for increasing the pattern density of an aluminum pad layer. A substrate is provided, and an aluminum pad material layer is formed on the substrate. Then, the aluminum pad material layer is patterned to form the aluminum pad layer which includes a plurality of aluminum pads and a plurality of dummy patterns, wherein the dummy patterns are distributed in the spaces between the aluminum pads. Besides, routings can be further disposed in the aluminum pad layer and the dummy patterns are distributed in the spaces between the aluminum pads, between the aluminum pads and the routings, or between the routings.
Bibliography:Application Number: US20060457140