Method of fabricating a circuit array substrate

• Main Authors: TAKAMI AKIHIRO, TAKEDA ATSUSHI, INADA KATSUHIKO, TABATAKE HIROSHI, IMAI NOBUO, KAWAMURA TETSUYA, KAWAMURA SHINICHI
• Format: Patent
• Language: English
• Published: 21.07.2009
• Subjects: ADVERTISING; ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICESUSING STATIC MEANS TO PRESENT VARIABLE INFORMATION; BASIC ELECTRIC ELEMENTS; CRYPTOGRAPHY; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; DISPLAY; EDUCATION; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; PHYSICS; SEALS; SEMICONDUCTOR DEVICES; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF

A circuit array substrate includes an optically transparent substrate, pixels having switching elements formed on the transparent substrate, gate electrode lines connected to the switching elements, the gate electrode lines being provided on a first insulation film with separating portions in the pixels, signal lines connected to the switching elements, the signal lines being provided on a second insulation film which is different from the first insulation film, and electrically conductive portions provided on the second film to electrically connect the electrode lines with the separating portions to each other. The separating portions reduce electrostatic capacitances defined between the gate electrode lines and the switching elements when the conductive portions are not connected between the separating portions.