Semiconductor chip

A semiconductor chip 100 includes a semiconductor substrate (not shown), and a stacked film 150 formed over the semiconductor substrate, which includes carbon-containing insulating films such as a first interlayer insulating film 106, and carbon-free insulating films such as an underlying layer 102...

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Bibliographic Details
Main Authors USAMI TATSUYA, OHTO KOICHI
Format Patent
LanguageEnglish
Published 21.07.2009
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor chip 100 includes a semiconductor substrate (not shown), and a stacked film 150 formed over the semiconductor substrate, which includes carbon-containing insulating films such as a first interlayer insulating film 106, and carbon-free insulating films such as an underlying layer 102 and a top cover film 124. The end faces of the carbon-free insulating films herein are located on the outer side of the end faces of the carbon-containing insulating films. The carbon composition of the carbon-containing insulating films is lowered in the end portions thereof than in the inner portions. The film density of the carbon-containing insulating films is raised in the end portions thereof than in the inner portions.
Bibliography:Application Number: US20060368671