Au-sn alloy powder for solder paste

The problem is to provide an Au-Sn alloy powder for use in producing an Au-Sn alloy solder paste having reduced generation of voids. The problem is solved by an Au-Sn alloy powder for a solder paste, which has a composition consisting of Sn of 20.5-23.5% by mass and a remainder containing Au and ine...

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Bibliographic Details
Main Authors KOHINATA MASAYOSHI, ISHIKAWA MASAYUKI, MISHIMA AKIHUMI
Format Patent
LanguageEnglish
Published 07.07.2009
Subjects
CASTING
MAKING METALLIC POWDER
MANUFACTURE OF ARTICLES FROM METALLIC POWDER
PERFORMING OPERATIONS
POWDER METALLURGY
TRANSPORTING
WORKING METALLIC POWDER
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Summary:The problem is to provide an Au-Sn alloy powder for use in producing an Au-Sn alloy solder paste having reduced generation of voids. The problem is solved by an Au-Sn alloy powder for a solder paste, which has a composition consisting of Sn of 20.5-23.5% by mass and a remainder containing Au and inevitable impurities, and which has a microstructure in which 0.5 to 30 area % of fine Sn-rich primary crystal phase regions having a diameter of 3 mum or less are crystallized in a matrix.
Bibliography:Application Number: US20060571289