Heat sink with thermoelectric module

An apparatus may include a thermally-conductive heat sink core having at least one surface, a solid-state heat pump including a first surface and a second surface, the first surface in contact with the at least one surface of the core, and a thermally-conductive unit in contact with the second surfa...

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Bibliographic Details
Main Authors SCOTT BRIAN A, GWIN PAUL J, SAUCIUC IOAN
Format Patent
LanguageEnglish
Published 30.06.2009
Subjects
BASIC ELECTRIC ELEMENTS
BLASTING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMBINED HEATING AND REFRIGERATION SYSTEMS
DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEAT EXCHANGE IN GENERAL
HEAT PUMP SYSTEMS
HEATING
LIGHTING
LIQUEFACTION SOLIDIFICATION OF GASES
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MANUFACTURE OR STORAGE OF ICE
MECHANICAL ENGINEERING
PRINTED CIRCUITS
REFRIGERATION MACHINES, PLANTS OR SYSTEMS
REFRIGERATION OR COOLING
SEMICONDUCTOR DEVICES
WEAPONS
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Summary:An apparatus may include a thermally-conductive heat sink core having at least one surface, a solid-state heat pump including a first surface and a second surface, the first surface in contact with the at least one surface of the core, and a thermally-conductive unit in contact with the second surface of the solid-state heat pump. Also included may be a stop in contact with the thermally-conductive unit, disposed at least partially over the first end of a cavity defined by the thermally-conductive unit, and defining an opening, and a fastener passing through the cavity, in contact with the core, and to bias the core toward the stop.
Bibliography:Application Number: US20060472927