Bumping process and bump structure

A bumping process comprises forming a passivation layer having a planarized surface covering a pad on a substrate, forming a hole penetrating through the passivation layer to expose a contact surface of the pad, and forming a bump on the contact surface and planarized surface. The planarized surface...

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Bibliographic Details
Main Authors TSI CHIEN-WEN, HU CHUN-PING, LEE YUING, CHEN CHENGUNG
Format Patent
LanguageEnglish
Published 09.06.2009
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A bumping process comprises forming a passivation layer having a planarized surface covering a pad on a substrate, forming a hole penetrating through the passivation layer to expose a contact surface of the pad, and forming a bump on the contact surface and planarized surface. The planarized surface will provide a larger effective area for pressing, thereby minimizing the pad, enhancing the mechanical strength at the peripheral of the pad, providing more selection flexibility for anisotropic conductive film, reducing the possibilities of short circuit and current leakage within the bump gap, and increasing the yield of the pressing process and the conductive quality of the bump.
Bibliography:Application Number: US20080081621