Micro-electro mechanical device made from mono-crystalline silicon and method of manufacture therefore

• Main Author: WAN CHANG-FENG
• Format: Patent
• Language: English
• Published: 02.06.2009
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS; SEMICONDUCTOR DEVICES; TRANSPORTING

The present invention is related to a method for manufacturing micro-electro-mechanical systems (MEMS) having movable and stationary suspended structures formed from mono-crystalline silicon wafer or chip, bonded to a substrate wafer with an polymer adhesive layer that serves as spacer and as a sacrificial layer which is undercut by dry etch means. The substrate wafer contains electronic circuits for sensing and actuating the suspended structure by electrical means. Electrical interconnections between the suspended structures and the substrate can be made by etching through via holes in the suspended structure and the adhesive, depositing metal layers in the via holes, and removing the metal layers from outside the via holes. The metal layers in the via holes can also be used as pillars for supporting the suspended structures. This method can be used to manufacture inertial sensors.