Method for packaging organic light emitting display with frit seal and reinforcing structure

Disclosed is a method for packaging an organic light emitting display having a reinforcing member between a first substrate and a second substrate by rolling a roll retaining a curable material on non-pixel regions of unit display panels. Organic light emitting pixel arrays are formed at a plurality...

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Bibliographic Details
Main Author LEE JAE SUN
Format Patent
LanguageEnglish
Published 07.04.2009
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Disclosed is a method for packaging an organic light emitting display having a reinforcing member between a first substrate and a second substrate by rolling a roll retaining a curable material on non-pixel regions of unit display panels. Organic light emitting pixel arrays are formed at a plurality of pixel regions of a first mother substrate. A frit is formed at a position of a second mother substrate corresponding to the non-pixel regions of the first mother substrate. The mother substrates are coalesced to each other and sealed by the frit. The first and second mother substrates are cut into unit display panels. The unit display panels are aligned. The curable material is coated at a side the unit display panels and cured to form the reinforcing member.
Bibliography:Application Number: US20060540084