Method of determining a flatness of an electronic device substrate, method of producing the substrate, method of producing a mask blank, method of producing a transfer mask, polishing method, electronic device substrate, mask blank, transfer mask, and polishing apparatus

A flatness of a substrate is determined to achieve a desired flatness of a mask blank by predicting the variation in flatness resulting from a film stress of a thin film formed on the substrate. The flatness is adjusted by measuring the flatness of the substrate as a measured flatness, selecting a l...

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Bibliographic Details
Main Authors KOIKE KESAHIRO, TOCHIHARA YASUTAKA, OHTSUKA MASATO
Format Patent
LanguageEnglish
Published 25.11.2008
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
APPARATUS THEREFOR
CHEMISTRY
CINEMATOGRAPHY
DECORATIVE ARTS
DRESSING OR CONDITIONING OF ABRADING SURFACES
ELECTROGRAPHY
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
HOLOGRAPHY
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
MATERIALS THEREFOR
METALLURGY
MOSAICS
ORIGINALS THEREFOR
PAPERHANGING
PERFORMING OPERATIONS
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
POLISHING
PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS
PRODUCING DECORATIVE EFFECTS
TARSIA WORK
TRANSPORTING
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Summary:A flatness of a substrate is determined to achieve a desired flatness of a mask blank by predicting the variation in flatness resulting from a film stress of a thin film formed on the substrate. The flatness is adjusted by measuring the flatness of the substrate as a measured flatness, selecting a load type with reference to the measured flatness, and polishing the substrate under pressure distribution specified by the load type. A principal surface of the substrate has a flatness greater than 0 mum and not greater than 0.25 mum. A polishing apparatus includes a rotatable surface table, a polishing pad formed thereon, abrasive supplying means for supplying an abrasive to the polishing pad, substrate holding means, and substrate pressing means for pressing the substrate. The substrate pressing means has a plurality of pressing members for individually and desirably pressing a plurality of divided regions of the substrate surface.
Bibliography:Application Number: US20050114002