Connector for testing a semiconductor package

In one embodiment, a connector is made using a mixture of insulating silicone powder and conductive powder. The connector comprises a connector body formed from the insulating silicone powder and on or more preferably regularly arrayed conductive silicone members that are formed by migrating the con...

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Bibliographic Details
Main Authors AN YOUNG-SOO, HWANG SOON-GEOL, BANG JEONG-HO, SHIM HYUN-SEOP, SEO HYUN-KYO, CHUNG YOUNG-BAE, LEE JAE-IL
Format Patent
LanguageEnglish
Published 21.10.2008
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Summary:In one embodiment, a connector is made using a mixture of insulating silicone powder and conductive powder. The connector comprises a connector body formed from the insulating silicone powder and on or more preferably regularly arrayed conductive silicone members that are formed by migrating the conductive powder to a site of the connector corresponding to a solder ball of the semiconductor package. The conductive silicone member comprises a high-density conductive silicone part formed to be proximate an upper surface of the connector body and to protrude therefrom and a low-density conductive silicone part formed in substantial vertical alignment beneath the high-density conductive silicone part, the low-density conductive silicone part having a lower surface exposed from a lower surface of the connector body.
Bibliography:Application Number: US20050295208