Silicone resins

A silicone resin, curable to a resin of low coefficient of thermal expansion, high glass transition temperature and high modulus, has the empirical formula (R3SiO1/2)a(R2SiO2/2)b(RSiO3/2)c(SiO4/2)d wherein each R is a hydrocarbon or substituted hydrocarbon group or a hydrogen atom; and a=0.02 to 0.8...

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Bibliographic Details
Main Authors DUPONT ANNE, LEE YEONG JOO, CHEVALIER PIERRE MAURICE, OU DUAN LI, ROBSON STEVEN
Format Patent
LanguageEnglish
Published 16.09.2008
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Summary:A silicone resin, curable to a resin of low coefficient of thermal expansion, high glass transition temperature and high modulus, has the empirical formula (R3SiO1/2)a(R2SiO2/2)b(RSiO3/2)c(SiO4/2)d wherein each R is a hydrocarbon or substituted hydrocarbon group or a hydrogen atom; and a=0.02 to 0.8; b=0 to 0.4; and c+d=0.2 to 0.98, where a+b+c+d=1.0, characterized in that at least 2 mole % of the siloxane units in the resin are of the formula R'SiO1/2, RR'2SiO1/2 or R'2SiO2/2, wherein each R' is an alkenyl group.
Bibliography:Application Number: US20050531163