Silicone resins
A silicone resin, curable to a resin of low coefficient of thermal expansion, high glass transition temperature and high modulus, has the empirical formula (R3SiO1/2)a(R2SiO2/2)b(RSiO3/2)c(SiO4/2)d wherein each R is a hydrocarbon or substituted hydrocarbon group or a hydrogen atom; and a=0.02 to 0.8...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
16.09.2008
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Subjects | |
Online Access | Get full text |
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Summary: | A silicone resin, curable to a resin of low coefficient of thermal expansion, high glass transition temperature and high modulus, has the empirical formula (R3SiO1/2)a(R2SiO2/2)b(RSiO3/2)c(SiO4/2)d wherein each R is a hydrocarbon or substituted hydrocarbon group or a hydrogen atom; and a=0.02 to 0.8; b=0 to 0.4; and c+d=0.2 to 0.98, where a+b+c+d=1.0, characterized in that at least 2 mole % of the siloxane units in the resin are of the formula R'SiO1/2, RR'2SiO1/2 or R'2SiO2/2, wherein each R' is an alkenyl group. |
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Bibliography: | Application Number: US20050531163 |