Controlling plasma processing using parameters derived through the use of a planar ion flux probing arrangement

Methods and apparatus for detecting and/or deriving the absolute values of and/or the relative changes in parameters such as the plasma potential and the ion flux using a Planar Ion Flux (PIF) probing arrangement are disclosed. The detected and/or derived values are then employed to control plasma p...

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Main Author KEIL DOUGLAS L
Format Patent
LanguageEnglish
Published 19.08.2008
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Abstract Methods and apparatus for detecting and/or deriving the absolute values of and/or the relative changes in parameters such as the plasma potential and the ion flux using a Planar Ion Flux (PIF) probing arrangement are disclosed. The detected and/or derived values are then employed to control plasma processing processes.
AbstractList Methods and apparatus for detecting and/or deriving the absolute values of and/or the relative changes in parameters such as the plasma potential and the ion flux using a Planar Ion Flux (PIF) probing arrangement are disclosed. The detected and/or derived values are then employed to control plasma processing processes.
Author KEIL DOUGLAS L
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Snippet Methods and apparatus for detecting and/or deriving the absolute values of and/or the relative changes in parameters such as the plasma potential and the ion...
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SubjectTerms MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
Title Controlling plasma processing using parameters derived through the use of a planar ion flux probing arrangement
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