Controlling plasma processing using parameters derived through the use of a planar ion flux probing arrangement
Methods and apparatus for detecting and/or deriving the absolute values of and/or the relative changes in parameters such as the plasma potential and the ion flux using a Planar Ion Flux (PIF) probing arrangement are disclosed. The detected and/or derived values are then employed to control plasma p...
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Format | Patent |
Language | English |
Published |
19.08.2008
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Abstract | Methods and apparatus for detecting and/or deriving the absolute values of and/or the relative changes in parameters such as the plasma potential and the ion flux using a Planar Ion Flux (PIF) probing arrangement are disclosed. The detected and/or derived values are then employed to control plasma processing processes. |
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AbstractList | Methods and apparatus for detecting and/or deriving the absolute values of and/or the relative changes in parameters such as the plasma potential and the ion flux using a Planar Ion Flux (PIF) probing arrangement are disclosed. The detected and/or derived values are then employed to control plasma processing processes. |
Author | KEIL DOUGLAS L |
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SubjectTerms | MEASURING MEASURING ELECTRIC VARIABLES MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE MEASURING MAGNETIC VARIABLES PHYSICS TESTING |
Title | Controlling plasma processing using parameters derived through the use of a planar ion flux probing arrangement |
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