Controlling plasma processing using parameters derived through the use of a planar ion flux probing arrangement

Methods and apparatus for detecting and/or deriving the absolute values of and/or the relative changes in parameters such as the plasma potential and the ion flux using a Planar Ion Flux (PIF) probing arrangement are disclosed. The detected and/or derived values are then employed to control plasma p...

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Bibliographic Details
Main Author KEIL DOUGLAS L
Format Patent
LanguageEnglish
Published 19.08.2008
Subjects
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER,MECHANICAL EFFICIENCY, OR FLUID PRESSURE
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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Summary:Methods and apparatus for detecting and/or deriving the absolute values of and/or the relative changes in parameters such as the plasma potential and the ion flux using a Planar Ion Flux (PIF) probing arrangement are disclosed. The detected and/or derived values are then employed to control plasma processing processes.
Bibliography:Application Number: US20060398306