MMIC having back-side multi-layer signal routing

• Main Authors: POZGAY JEROME H, KAZIOR THOMAS E, MCCARROLL CHRISTOPHER P, LARDIZABAL STEVEN M, ADLERSTEIN MICHAEL G
• Format: Patent
• Language: English
• Published: 17.06.2008
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method includes providing a single crystal wafer having MMIC chips. Each chip has an active device in a first surface portion of a semiconductor substrate provided by the wafer and an electrical interconnect having a first portion disposed on a second surface of the semiconductor substrate. The semiconductor substrate structure has a via therethrough, a second portion of the electrical interconnect passing through the via and being electrically connected to the active device. A multilayer interconnect structure is formed on the wafer providing a signal routing section on the second surface portion of a corresponding one of the chips. Each section has dielectric layers and an electrical conductor, such electrical conductor being electrically coupled to the active device to route an electrical signal to such active device. Each chip and the corresponding signal routing section are separated from the wafer.