Dielectric layer for semiconductor device and method of manufacturing the same
A semiconductor device comprises a silicate interface layer and a high-k dielectric layer overlying the silicate interface layer. The high-k dielectric layer comprises metal alloy oxides.
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
13.05.2008
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Subjects | |
Online Access | Get full text |
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Summary: | A semiconductor device comprises a silicate interface layer and a high-k dielectric layer overlying the silicate interface layer. The high-k dielectric layer comprises metal alloy oxides. |
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Bibliography: | Application Number: US20040027256 |