Method for interconnecting semiconductor components with substrates and contact means

• Main Author: DOTSIKAS IOANNIS
• Format: Patent
• Language: English
• Published: 29.04.2008
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE

A semiconductor component includes a substrate having a plurality of compliant contact bumps formed over a surface thereof. A semiconductor chip has a plurality of contact regions formed over a surface thereof. The compliant contact bumps of the substrate are electrically connected with the contact regions of the semiconductor chip and wherein the semiconductor chip is mechanically attached to the substrate. As an example, this connection and attachment can be achieved by soldering the contact bumps to the contact regions.