Method and apparatus for redirecting void diffusion away from vias in an integrated circuit design

A method and apparatus for redirecting void diffusion away from vias in an integrated circuit design includes steps of forming an electrical conductor in a first electrically conductive layer of an integrated circuit design, forming a via between a distal end of the electrical conductor and a second...

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Main Authors ALLMAN DERRYL D. J, SUN SEY-SHING, MAY CHARLES E, PRITCHARD DAVID, KWAK BYUNG-SUNG, PRICE DAVID T, BURKE PETER AUSTIN, BHATT HEMANSHU D
Format Patent
LanguageEnglish
Published 22.04.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method and apparatus for redirecting void diffusion away from vias in an integrated circuit design includes steps of forming an electrical conductor in a first electrically conductive layer of an integrated circuit design, forming a via between a distal end of the electrical conductor and a second electrically conductive layer of the integrated circuit design, and reducing tensile stress in the electrical conductor to divert void diffusion away from the via.
Bibliography:Application Number: US20050323400