Polishing pad

• Main Authors: VANGSNESS JEAN, POTNIS ALAKA, HSU OSCAR KAI CHI
• Format: Patent
• Language: English
• Published: 15.04.2008
• Subjects: BRAIDING; COTTON-WOOL; DRESSING OR CONDITIONING OF ABRADING SURFACES; FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS,NON-WOVEN FABRICS; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; KNITTING; LACE-MAKING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARYMATERIAL; NON-WOVEN FABRICS; PERFORMING OPERATIONS; POLISHING; TEXTILES; TOOLS FOR GRINDING, BUFFING, OR SHARPENING; TRANSPORTING; TRIMMINGS; WADDING

An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optiona...