Polishing pad

An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optiona...

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Bibliographic Details
Main Authors VANGSNESS JEAN, POTNIS ALAKA, HSU OSCAR KAI CHI
Format Patent
LanguageEnglish
Published 15.04.2008
Subjects
BRAIDING
COTTON-WOOL
DRESSING OR CONDITIONING OF ABRADING SURFACES
FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS,NON-WOVEN FABRICS
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
KNITTING
LACE-MAKING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARYMATERIAL
NON-WOVEN FABRICS
PERFORMING OPERATIONS
POLISHING
TEXTILES
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
TRIMMINGS
WADDING
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Summary:An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.
Bibliography:Application Number: US20060424466