Polishing pad
An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optiona...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
15.04.2008
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Subjects | |
Online Access | Get full text |
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Abstract | An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component. |
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AbstractList | An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component. |
Author | HSU OSCAR KAI CHI POTNIS ALAKA VANGSNESS JEAN |
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Snippet | An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles... |
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SubjectTerms | BRAIDING COTTON-WOOL DRESSING OR CONDITIONING OF ABRADING SURFACES FABRICS MADE BY SUCH PROCESSES OR APPARATUS, e.g. FELTS,NON-WOVEN FABRICS FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING KNITTING LACE-MAKING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING MAKING TEXTILE FABRICS, e.g. FROM FIBRES OR FILAMENTARYMATERIAL NON-WOVEN FABRICS PERFORMING OPERATIONS POLISHING TEXTILES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING TRIMMINGS WADDING |
Title | Polishing pad |
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