Method of fabricating printed circuit board having thin core layer
A method is directed towards fabricating a printed circuit board (PCB) having a thin core layer. In the method, a substrate, where a copper foil is formed on a release film and a prepreg, is employed as a base substrate and a core insulating layer is removed after the fabrication of the PCB, thereby...
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| Main Authors | , , , |
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| Format | Patent |
| Language | English |
| Published |
25.03.2008
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| Subjects | |
| Online Access | Get full text |
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| Abstract | A method is directed towards fabricating a printed circuit board (PCB) having a thin core layer. In the method, a substrate, where a copper foil is formed on a release film and a prepreg, is employed as a base substrate and a core insulating layer is removed after the fabrication of the PCB, thereby reducing the thickness of the final product. |
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| AbstractList | A method is directed towards fabricating a printed circuit board (PCB) having a thin core layer. In the method, a substrate, where a copper foil is formed on a release film and a prepreg, is employed as a base substrate and a core insulating layer is removed after the fabrication of the PCB, thereby reducing the thickness of the final product. |
| Author | KIM DONG KUK KIM CHONG HO LEE HYO SOO SHIN YOUNG HWAN |
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| Notes | Application Number: US20050086642 |
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| RelatedCompanies | SAMSUNG ELECTRO-MECHANICS CO., LTD |
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| Snippet | A method is directed towards fabricating a printed circuit board (PCB) having a thin core layer. In the method, a substrate, where a copper foil is formed on a... |
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| SubjectTerms | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| Title | Method of fabricating printed circuit board having thin core layer |
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