Method of fabricating printed circuit board having thin core layer
A method is directed towards fabricating a printed circuit board (PCB) having a thin core layer. In the method, a substrate, where a copper foil is formed on a release film and a prepreg, is employed as a base substrate and a core insulating layer is removed after the fabrication of the PCB, thereby...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
25.03.2008
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Subjects | |
Online Access | Get full text |
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Summary: | A method is directed towards fabricating a printed circuit board (PCB) having a thin core layer. In the method, a substrate, where a copper foil is formed on a release film and a prepreg, is employed as a base substrate and a core insulating layer is removed after the fabrication of the PCB, thereby reducing the thickness of the final product. |
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Bibliography: | Application Number: US20050086642 |