Method for fabricating a resistor

A method of manufacturing an inexpensive fine resistor which do not require dimensional classifications of discrete substrates is disclosed. The method eliminates a process of replacing a mask according to a dimensional ranking of each discrete substrate. The method includes: dividing an insulated s...

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Bibliographic Details
Main Authors KAITO HIROAKI, MATSUKAWA TOSHIKI, SAIKAWA HIROYUKI, MORIMOTO YOSHIRO, FUKUOKA AKIO, HAYASE JUNICHI, HASHIMOTO MASATO
Format Patent
LanguageEnglish
Published 26.02.2008
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Summary:A method of manufacturing an inexpensive fine resistor which do not require dimensional classifications of discrete substrates is disclosed. The method eliminates a process of replacing a mask according to a dimensional ranking of each discrete substrate. The method includes: dividing an insulated substrate sheet along a first slit dividing portion and a second dividing portion perpendicular to the first dividing portion; forming a top electrode layer on a top face of the discrete substrate; forming a resistor layer such that a part of the resistor layer overlaps the top electrode layer; forming protective layers so as to cover the resistor layer; and forming side electrode layer on a side face of the discrete substrate such that the side electrode layer is electrically coupled to the top electrode layer.
Bibliography:Application Number: US20050037935