Vapor deposition of dissimilar materials

A method for depositing a first material on a substrate includes providing the substrate in a deposition chamber. A molten body is formed between the substrate and a source of the first material by melting one or more second materials. A flow of the first material is passed through the molten body a...

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Main Authors MEMMEN ROBERT L, SERHIYENKO GREGORY A, SHELKOVOY, LEGAL REPRESENTATIVE EVGENIY A, RUTZ DAVID A, BELOUSOV IGOR V, KINSTLER MONIKA D, MALASHENKO IGOR S
Format Patent
LanguageEnglish
Published 12.02.2008
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Summary:A method for depositing a first material on a substrate includes providing the substrate in a deposition chamber. A molten body is formed between the substrate and a source of the first material by melting one or more second materials. A flow of the first material is passed through the molten body and from the molten body to the substrate as a vapor flow. An essentially non-expending portion of the molten body comprises an alloy having a melting temperature below a melting temperature of the first material.
Bibliography:Application Number: US20040991605