Vapor deposition of dissimilar materials
A method for depositing a first material on a substrate includes providing the substrate in a deposition chamber. A molten body is formed between the substrate and a source of the first material by melting one or more second materials. A flow of the first material is passed through the molten body a...
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Main Authors | , , , , , , |
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Format | Patent |
Language | English |
Published |
12.02.2008
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Subjects | |
Online Access | Get full text |
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Summary: | A method for depositing a first material on a substrate includes providing the substrate in a deposition chamber. A molten body is formed between the substrate and a source of the first material by melting one or more second materials. A flow of the first material is passed through the molten body and from the molten body to the substrate as a vapor flow. An essentially non-expending portion of the molten body comprises an alloy having a melting temperature below a melting temperature of the first material. |
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Bibliography: | Application Number: US20040991605 |