System for populating a circuit board with semiconductor chips

A system for populating a three dimensional array of semiconductor chips is disclosed. The system facilitates the surface mounting of semiconductor chips with chip carriers to achieve the three dimensional array of chips. The system includes a chip carrier pallet that holds and moves the chip carrie...

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Bibliographic Details
Main Author KLEDZIK KENNETH J
Format Patent
LanguageEnglish
Published 08.01.2008
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMBINED OPERATIONS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
OTHER WORKING OF METAL
PERFORMING OPERATIONS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
TRANSPORTING
UNIVERSAL MACHINE TOOLS
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Summary:A system for populating a three dimensional array of semiconductor chips is disclosed. The system facilitates the surface mounting of semiconductor chips with chip carriers to achieve the three dimensional array of chips. The system includes a chip carrier pallet that holds and moves the chip carriers for the automatic assembly of a circuit board. The system also may include a print fixture pedestal that works in combination with the chip carrier pallet to position chip carriers for automatic deposition of solder on a multitude of carriers at once, and then position them for addition to a circuit board.
Bibliography:Application Number: US20040829895