Apparatus for controlling thermal interface between cold plate and integrated circuit chip

• Main Authors: REYZIN ILYA, HAYES ANDREW R, BHATTI MOHINDER SINGH, SCHERER LAWRENCE P, JOSHI SHRIKANT MUKUND
• Format: Patent
• Language: English
• Published: 09.10.2007
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CONDUCTORS; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION; HEAT EXCHANGE IN GENERAL; HEATING; INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINEDOPTICAL AND ELECTRIC CABLES OR LINES; INSULATORS; LIGHTING; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MECHANICAL ENGINEERING; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SEMICONDUCTOR DEVICES; WEAPONS

The invention provides a heat sink device for receiving heat generated by an electrical chip. The heat sink device includes a cold plate having a bottom surface for receiving heat from the electrical chip and a top surface opposite of the bottom surface. The heat sink device also includes a finger member having a rounded tip centered on the top surface. The heat sink device also includes a force generating device having an anvil spaced from the finger member and a compressible member compressed between the anvil and the finger member. The compressible member generates a pressing force urging the finger member and the top surface together. The heat sink device also includes a moving device operable to move one of the anvil and the finger member relative to the other to change the pressing force generated by the compressible member.