Attachment of integrated circuit structures and other substrates to substrates with vias

Vias ( 210, 210 B) are formed in a surface of a substrate. At least portions of contact pads ( 139, 350 ) are located in the vias. Contact pads ( 150, 340 ) of an integrated circuit structure are inserted into the vias and attached to the contact pads ( 139, 350 ) of the substrate. The vias provide...

Full description

Saved in:
Bibliographic Details
Main Authors SAVASTIOUK SERGEY, KAO SAM
Format Patent
LanguageEnglish
Published 10.07.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:Vias ( 210, 210 B) are formed in a surface of a substrate. At least portions of contact pads ( 139, 350 ) are located in the vias. Contact pads ( 150, 340 ) of an integrated circuit structure are inserted into the vias and attached to the contact pads ( 139, 350 ) of the substrate. The vias provide a strong, reliable mechanical and electrical connection. A via may expose not only a contact pad ( 350 ) in the substrate but also a surrounding region. Solder ( 930 ) wets the contact pad better than the surrounding region, resulting in a stronger solder joint and better electrical conductivity. Alternatively, the contact may include multiple conductive layers ( 910.1, 910.2 ), with the top layer ( 910.2 ) being more solder wettable than the bottom layer ( 910.1 ) and the top layer covering only a portion of the bottom layer.
Bibliography:Application Number: US20040798540