Method for fabricating leadless packages with mold locking characteristics

A method for fabricating leadless packages with mold locking characteristics is disclosed. A provided leadless leadframe has a plurality of units in a matrix, each unit includes an improved die pad with a plurality of indentations, such as semi-vias in the sidewall thereof and a plurality of leads a...

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Bibliographic Details
Main Authors LEE YONG-GILL, PARK SANG-BAE, WON JIN-HEE, PARK HYUNG-JUN, RHO KYUNG-SOO
Format Patent
LanguageEnglish
Published 01.05.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method for fabricating leadless packages with mold locking characteristics is disclosed. A provided leadless leadframe has a plurality of units in a matrix, each unit includes an improved die pad with a plurality of indentations, such as semi-vias in the sidewall thereof and a plurality of leads around the die pad. After chip attachment and electrical connection, a plurality of package bodies for semiconductor packages are individually formed on the corresponding units and covered the indentations in order to enhance the horizontal mold locking capability of the die pad. Using punching, connecting bars of the leadless leadframe are removed to isolate the leadless packages.
Bibliography:Application Number: US20040973385